Ceramic End Effector with porous ceramic built in suitable for handling warped wafer or thin wafer that cannot be held properly with the standard vacuum suction type end-effector. Thinned wafer delivers a major problem for normal end effectors because the unsupported area of a wafer is usually deformed at the open vacuum area.
High purity alumina ceramic sintered body is used for the main body of end-effector, and porous ceramic is used for the wafer suction surface.
Porous end-effector can hold thin wafer without deformation.
Conductive Teflon coating is available for suction surface.
SPECS
| Material | Alumina ceramic or SiC |
|---|---|
| Material of Suction Surface | Porous ceramic |
| Wafer Holding Method | Vacuum suction |
| Thickness | 2-4mm |
| Particle Size of Mesh | 40 to 60µm |
| Pore Size | 20µm,30µm,40µm |
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